Base plate fixing structure for a heat dissipating module

ABSTRACT

A base plate fixing structure for a heat dissipating module includes a base plate and a plurality of fixing components. At a center of the base plate is disposed a through groove. At a bottom edge of the through groove is disposed a holding and engaging part extending and protruding inwards. On two sides of the through groove are respectively disposed two or more than two corresponding fixing holes. On two ends of the through groove are respectively disposed a containing rod arching upwards. The plurality of fixing components each includes a horizontal section and vertical sections extending downwards from two ends of the horizontal section. During assembly, one end of the heat pipe is run through the through groove of the base plate with the containing rod and the holding and engaging part limiting its position. The fixing components are joined to the fixing holes through their vertical sections. The horizontal sections are used to press the heat pipe so that the heat pipe is tightly fixed to the base plate. The fore-going combination facilitates the assembly of a heat dissipating module at a reduced assembly cost.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a base plate fixing structure for aheat dissipating module, particularly to a base plate fixing structurefor a heat dissipating module which facilitates the assembly of a baseplate and a heat pipe for a heat dissipating module at a reducedassembly cost.

2. Description of Related Art

Existing CPUs in laptops usually generate a huge amount of heat energyin working states, which causes the temperature of electronic componentsto rise. Without adequate heat dissipation, those electronic componentswill overheat, which may destabilize their operation and may even causethe entire electronic device to stop working or crash. As the workingspeed of all kinds of electronic components is constantly improved, theamount of heat energy generated in working states also increases greatlyand may burn down the CPU completely. Therefore, heat dissipatingdevices for all kinds of chips have become a major issue nowadays.

Current heat dissipating devices and heat dissipating modules generallycomprise varying combinations of a plurality of identical or diverseheat dissipating components. These heat dissipating components may beheat pipes, heat sinks, heat dissipating base plates, and so on. Theyare generally assembled and fixed by soldering. But when solderingaluminum heat dissipating components, some preliminary procedures arerequired before carrying out a special soldering process. Not only isthe manufacturing process complicated and the manufacturing costincreased, but harmful substances are also produced and pollute theenvironment.

As FIG. 1 shows, a heat pipe is connected to a heat dissipating plateand heat dissipating fins. A CPU is fixed to a bottom edge of the heatdissipating plate. The heat energy generated by the CPU is conducted bythe heat pipe and dissipated through the heat dissipating fins. In aconventional process of manufacturing a heat dissipating module, theheat pipe is assembled using tin soldering. In the process, the materialis first plated with nickel and then soldered with tin solder when beingassembled. But this conventional process of assembly has the followingdrawbacks:

1. The material cost of nickel-plating and tin soldering is high. Theywill also generate harmful substances and pollute the environment.

2. It is less effective in conducting heat.

In view of this, after laborious research and experiments, the applicanthas devised a fixing structure for a heat dissipating module whichfacilitates the assembly of a heat dissipating module at a reducedassembly cost.

SUMMARY OF THE INVENTION

It is an object of the present invention to provide a base plate fixingstructure for a heat dissipating module which facilitates the assemblyof a heat dissipating module by doing without the process of solderingand reduces the assembly cost.

It is another object of the present invention to provide a base platefixing structure for a heat dissipating module which comprises a baseplate and a plurality of fixing components. At a center of the baseplate is disposed a through groove. At a bottom edge of the throughgroove is disposed a holding and engaging part extending and protrudinginwards. On two sides of the through groove are respectively disposedtwo or more than two corresponding fixing holes. On two ends of thethrough groove are respectively disposed a containing rod archingupwards. The plurality of fixing components includes a horizontalsection and vertical sections extending downwards from two ends of thehorizontal section. During assembly, one end of the heat pipe is runthrough the through groove of the base plate with the containing rod andthe holding and engaging part limiting its position. The fixingcomponents are joined to the fixing holes through their verticalsections. The horizontal sections are used to press the heat pipe sothat the heat pipe is tightly fixed to the base plate. The fore-goingcombination facilitates the assembly of a heat dissipating module at areduced assembly cost.

Further, the holding and engaging part disposed at a bottom edge of thethrough groove of the base plate is an arc extending inwards. Further,the vertical sections of the fixing components are slightly bigger thanthe hole size of the fixing holes on the base plate, so that whenpressed into the fixing holes the vertical sections are tightly snappedfit to the fixing holes. Further, the vertical sections of the fixingcomponents may also be configured as bending upwards to form a V shapefrom bottom ends to produce appropriate flexibility, so that afterpassing through the fixing holes the vertical sections are tightlysnapped fit to the fixing holes. Further, the horizontal section of thefixing components may be configured as containing arcs bending downwardsnear the vertical sections to produce appropriate flexibility andfacilitate pressing down of the heat pipe for fixing.

The fixing structure for a heat dissipating module of the presentinvention facilitates assembly of a heat dissipating module at a reducedcost. It also reduces the thickness and weight of a heat dissipatingmodule with improved quality.

BRIEF DESCRIPTION OF THE INVENTION

FIG. 1 is a pictorial drawing of a conventional heat dissipating module;

FIG. 2 is a pictorial break-down drawing of a base plate and a heat pipeof the present invention;

FIG. 3 is a pictorial drawing of a base plate and a heat pipe of thepresent invention;

FIG. 4 is a pictorial drawing of a heat dissipating module of thepresent invention;

FIG. 5 is a view of the present invention during assembly;

FIG. 6 is a cross-sectional view of the present invention afterassembly.

FIG. 7 is a view of a second preferred embodiment of the presentinvention during assembly.

FIG. 8 is a view of a third preferred embodiment of the presentinvention during assembly.

FIG. 9 is a view of a fourth preferred embodiment of the presentinvention during assembly.

FIG. 10 is a view of a fifth preferred embodiment of the presentinvention during assembly.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

Please refer to FIGS. 2 and 3, along with FIGS. 4, 5, and 6, showingrespectively a pictorial break-down drawing of a base plate and a heatpipe of the present invention, a pictorial drawing of a base plate and aheat pipe of the present invention, a pictorial drawing of a heatdissipating module of the present invention, a view of the presentinvention during assembly, and a cross-sectional view of the presentinvention after assembly. As the figures show, the present inventionincludes a base plate 4, heat dissipating fins 5, a heat pipe 6connected to the base plate 4 and the heat dissipating fins 5, andfixing components 7 for fixing the heat pipe 6. At a center of the baseplate 4 is disposed a through groove 41. At a bottom edge of the throughgroove 41 is disposed a holding and engaging part 411 extending andprotruding inwards. On two sides of the through groove 41 arerespectively disposed two or more than two corresponding fixing holes 42(two fixing holes 42 are respectively disposed on two sides of thethrough groove 41 in this preferred embodiment). On two ends of thethrough groove 41 are respectively disposed a containing rod 43 archingupwards. The plurality of fixing components 7 each includes a horizontalsection 71 and vertical sections 72 extending downwards from two ends ofthe horizontal section 71. The vertical sections 72 of the fixingcomponents 7 are slightly bigger than the hole size of the fixing holes42 of the base plate 4 for having the vertical sections 72 tightlysnapped fit to the fixing holes 42.

During assembly, one end of the heat pipe 6 is run through the throughgroove 41 of the base plate 4 with the containing rod 43 above and theholding and engaging part 411 below limiting its position. The fixingcomponents 7 are joined to the fixing holes 42 through their verticalsections 72. The horizontal sections 71 of the fixing components 7 areused to press the heat pipe 6 so that the heat pipe 6 is tightly fixedto the base plate 4. The fore-going combination facilitates the assemblyof a base plate 4 for a heat dissipating module at a reduced assemblycost.

Please refer to FIGS. 5 and 6, along with FIG. 3. As the figures show,during assembly, the heat pipe 6 is run through the through groove 41 ofthe base plate 4. On a bottom edge of the through groove 41 is disposeda holding and engaging part 411 configured as an arc extending andprotruding inwards. When the heat pipe 6 is run through the throughgroove 41, the holding and engaging part 411 holds a bottom edge of oneend of the heat pipe 6, and the position of the upper edge of the heatpipe 6 is limited by the containing rod 43 to prevent the heat pipe 6from coming off. Further, the vertical sections 72 of the fixingcomponents 7 are snapped fit to the fixing holes 42 on the base plate 4.The horizontal sections 71 of the fixing components 7 are pressed totightly snap fit the heat pipe 6 to the base plate 4.

Please refer to FIGS. 7 and 8, showing views of a second and a thirdembodiment of the present invention during assembly. As the figuresshow, the vertical sections 72 of the fixing components 7 of the presentinvention may also be configured as bending upwards to form a V shapefrom bottom ends to produce appropriate flexibility, so that afterpassing through the fixing holes 42 the vertical sections 72 are tightlysnapped fit to the fixing holes 42.

Please refer to FIGS. 9 and 10, showing views of a fourth and a fifthembodiment of the present invention during assembly. As the figuresshow, the horizontal sections 71 of the fixing components 7 may beconfigured as containing arcs bending downwards near the verticalsections 72 to produce appropriate flexibility, so that after passingthrough the fixing holes 42 the vertical sections 72 are tightly snappedfit to the fixing holes 42 and press the heat pipe 6 down by means ofthe downward bending arcs.

Compared with the assembly of a conventional heat dissipating module,the present invention has at least the following advantages:

1. No nickel-plating and tin soldering are needed to assemble thepresent invention, which reduces its material cost and is eco-friendly.

2. It is more efficient in conducting heat.

3. Its production cost is reduced.

The fore-going preferred embodiments of the present invention areillustrated of the present invention rather than limiting of the presentinvention. It is intended to cover various modifications and changesincluded within the spirit and scope of the appended claims, the scopeof which should be accorded the broadest interpretation so as toencompass all such modifications and similar structures.

In view of the foregoing considerations, the present invention relatesto a fixing structure for a heat dissipating module comprising a baseplate with a through groove and fixing holes, and fixing components forfixing. It facilitates the assembly of a base plate and a heat pipe of aheat dissipating module at a reduced assembly cost and is alsoeco-friendly.

What is claimed is:
 1. A fixing structure for a heat dissipating module,comprising: a base plate, at a center of the base plate is disposed athrough groove, at a bottom edge of the through groove is disposed aholding and engaging part extending and protruding inwards, on two sidesof the through groove are respectively disposed two or more than twocorresponding fixing holes, and on two ends of the through groove arerespectively disposed a containing rod arching upwards; a plurality offixing components, each comprising a horizontal section and verticalsections extending downwards from two ends of the horizontal section; aheat pipe, one end of the heat pipe is disposed inside the throughgroove; wherein during assembly, one end of the heat pipe is run throughthe through groove of the base plate with the containing rod above andthe holding and engaging part below limiting its position, the fixingcomponents are joined to the fixing holes through their verticalsections, the horizontal sections are used to press the heat pipe, andthe heat pipe is tightly fixed to the base plate through the fixingcomponents.
 2. The base plate fixing structure for a heat dissipatingmodule of claim 1, wherein the holding and engaging part disposed at abottom edge of the through groove of the base plate is configured as anarc extending and protruding inwards.
 3. The base plate fixing structurefor a heat dissipating module of claim 1, wherein the vertical sectionsof the fixing component are slightly bigger than the hole size of thefixing holes of the base plate, so that when pressed into the fixingholes the vertical sections are tightly snapped fit to the fixing holes.4. The base plate fixing structure for a heat dissipating module ofclaim 1, wherein the vertical sections of the fixing component may alsobe configured as bending upwards to form a V shape from bottom ends toproduce appropriate flexibility.